Introduction to QSPI High‑Resolution Module
To meet customer demands for driving higher‑resolution and larger‑size modules via QSPI/8080 interfaces, Shanghai TDO Display Optoelectronics has innovatively developed the dedicated bridge chip TR230S, fundamentally solving the pain point that low‑speed interfaces cannot drive large‑size high‑resolution modules. The TR230S is a high‑performance display bridge chip built on the RISC‑V architecture. It converts standard QSPI/SPI/8080 interfaces into RGB display interfaces, easily driving high‑resolution TFT‑LCD modules ranging from 2.1‑inch to 10.1‑inch, with resolutions covering 480×480 to 1024×600.
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TR230S Chip Features
The TR230S is a proprietary display bridge chip independently developed by TDO. Based on the RISC‑V processor architecture, it integrates large‑capacity frame buffer and hardware acceleration engine, delivering outstanding interface conversion capability and image processing performance.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Processor Architecture | RISC‑V @ 400MHz |
| Input Interface | QSPI / SPI / MCU 8080 (3‑wire / 4‑wire) |
| Output Interface | RGB 18/24‑bit |
| Maximum Resolution | 1024×768 (RGB) |
| Frame Buffer | On‑chip large‑capacity SRAM, full‑frame buffer supported |
| Color Depth | 16‑bit (RGB565) |
| Power Supply Voltage | 5V single‑supply power |
| Power Consumption | Typical < 200 mW; low‑power standby mode < 50 μA |
| Operating Temperature | ‑20°C ~ +70°C (‑40°C ~ +85°C industrial‑grade option available) |
| Package | QFN68 (68‑pin, 7 mm × 7 mm) |
Technical Highlights
- Multi‑protocol Input Compatibility: Supports QSPI (4‑wire high‑speed), SPI (3‑wire / 4‑wire standard) and MCU 8080 parallel interfaces, compatible with most mainstream MCU platforms on the market.
- Intelligent Protocol Conversion: Hardware performs automatic QSPI‑to‑RGB protocol conversion. No adaptation is required on the host side to achieve true plug‑and‑play operation.
- Hardware‑Accelerated Refresh: Built‑in DMA engine and hardware acceleration unit support high‑frame‑rate screen refresh (typical 30fps@800×480), eliminating screen tearing and stuttering.
- Ultra‑Low Host Load: Only a small set of QSPI commands from the host are required for screen updates, freeing host‑CPU resources for other tasks.
TR230S Chip Advantages
| TR230S (TDO) | Company A | Company B | Company C | |
|---|---|---|---|---|
| Input Interface | SPI / QSPI / 8080 | SPI / Dual SPI / QSPI | 8080 / 6800 | SPI / 8080 / 6800 |
| Maximum Resolution | 1024 * 768 | 800 * 600 | 864 * 480 | 800 * 480 |
| SPI / 8080 Refresh Rate | 100 MHz (SPI) 50 MHz (8080) | 30 MHz (SPI) | 50 MHz (8080) | 30 MHz (SPI) 50 MHz (8080) |
| Display Engine | Supported | Supported | Not supported | Not supported |
| Graphics Engine | Supported | Supported | Not supported | Not supported |
| On‑Chip Memory | 8 MB | 1 MB | 1 MB | 768 KB |
| Embedded Flash | 8 MB | No | Not supported | Not supported |
| Colors | 16.7 M | 16.7 M | 16.7 M | 65 K |
| Built‑in Font Library | Supported | Supported | Not supported | Not supported |
| Package (mm) | QFN68 (7 * 7) | VQFN56 (8 * 8) | LQFP‑128 (16 * 16) | LQFP‑100 (14 * 14) |
📌 Key Advantages of TR230S Broader interface coverage: SPI / QSPI / 8080 multi‑interface combination. Higher resolution: 1024×768, 28% higher than Company A and more than twice that of Company B and C. Larger memory: 8 MB on‑chip memory + 8 MB embedded flash, 8 times larger than Company A’s 1 MB. Compact package: QFN68 (7×7), easier integration into small‑size modules.
Product Form Factor Comparison
To satisfy diverse customer integration requirements, the QSPI high‑resolution module is offered in three product variants for flexible project‑oriented selection:
| Feature | Standard Small Board | COF (Chip on FPC) | Integrated Plastic‑Cased Module |
|---|---|---|---|
| Structure | PCB onboard + pin header output | Chip bonded on FPC | Module plus integrated mechanical housing |
| Thickness | Relatively thick (with PCB) | Ultra‑thin (FPC + display only) | Subject to mechanical design |
| Development Ease | ⭐⭐⭐⭐⭐ Plug‑and‑play | ⭐⭐⭐ Requires custom adapter board | ⭐⭐⭐⭐⭐ Ready‑to‑use |
| Integration Flexibility | ⭐⭐⭐ Fixed dimensions | ⭐⭐⭐⭐⭐ Maximum flexibility | ⭐⭐ Fixed mechanical structure |
| Mass‑Production Cost | Moderate | Low | Moderate (includes mechanical parts) |
| Applicable Phase | Prototype verification, small‑batch | High‑volume customization | Mass production |
| Typical Part Number | TS034WVS02NP‑B1477A | TS050WVH02CQ‑B8003A | TS070WVH03CP‑B1705A |
Resolution Coverage
The TR230S supports multiple resolution combinations covering mainstream application scenarios:
| Resolution | Typical Size | Typical Application | Typical Part Number |
|---|---|---|---|
| 480×480 | 2.1" / 2.8" / 3.4" / 4.0" | Smart watches, round panels | TS021WVC02NP‑B1323B |
| 320×820 | 2.86" | Bar‑type displays, smart speakers | TS028FWV02NP‑I1440A |
| 340×800 | 3.5" | Hand‑held devices, instrument clusters | TS035WVV02NP‑B1683A |
| 400×960 | 3.99" | Bar‑type panels, smart home | TS040FWV02NP‑B1519B |
| 720×720 | 4.0" | Round control panels, smart home appliances | TS040HDC02NP‑B1613A |
| 800×480 | 4.3" / 5.0" / 7.0" | HMI, industrial displays | TS050WVH02CQ‑B8003A |
| 480×854 | 5.0" | Portrait‑mode handheld devices | TS050FWV01NP‑H1336A |
| 480×960 | 6.0" | Portrait‑mode displays, advertising players | TS060WVV02NP‑I1360A |
| 1024×600 | 7.0" / 10.1" | High‑definition industrial screens, POS terminals | TS101WSH02CQ‑B8014A |
Application Scenarios
QSPI high‑resolution module solutions based on TR230S are widely deployed in the following fields:
| Industry | Typical Applications |
|---|---|
| Smart Home | Control panels, thermostats, smart locks, smart speaker displays |
| Industrial Control | HMI, PLC displays, instruments & meters, inverter panels |
| Medical Equipment | Pulse oximeters, blood‑pressure monitors, portable patient monitors, infusion pump displays |
| Consumer Electronics | Desktop ornaments, electronic labels, smart watches, translators |
| Automotive Display | Instrument cluster secondary screen, auxiliary central‑control display, dash‑cam |
| IoT | Various embedded terminal display devices |
Quick Start
Follow the steps below to get started with the QSPI high‑resolution module:
Step 1: Select Module
Filter for suitable part numbers in Product List according to size, resolution and product‑form‑factor requirements.
Step 2: Hardware Connection
Connect the QSPI/SPI interface of the module to corresponding signals on the host board following pin definitions in datasheet. QSPI mode only requires 6 signal lines (CS, SCLK, IO0~IO3) for simple wiring.
Step 3: Initialization Configuration
Complete register initialization including backlight enable and display‑area configuration, referring to driver instructions in FAQ.
Step 4: Run Demo
Download Sample Code (supports STM32, ESP32 and other platforms) to quickly verify display performance.
💡 Note: For further technical support, please visit Technical Support Page or follow WeChat official account "上海冠显光电" for one‑on‑one technical assistance.
QSPI高分辨率模组介绍
为了满足客户端通过QSPI/8080接口驱动更高分辨率和更大尺寸模组的需求，上海冠显光电（TDO）</st创新研发了专用转接芯片TR230S，从根本上解决低速接口无法驱动大尺寸高分辨率模组的痛点。TR230S 是一款基于 RISC-V 架构的高性能显示桥接芯片，可将标准 QSPI/SPI/8080 接口转换为 RGB 显示接口，轻松驱动从 2.1英寸到10.1英寸的高分辨率 TFT-LCD 模组，分辨率覆盖480×480 至 1024×600
TR230S 芯片特性
TR230S 是冠显自主研发的专用显示桥接芯片，基于 RISC-V 处理器架构，内置大容量帧缓存与硬件加速引擎，具备卓越的接口转换能力和画面处理性能。
硬件规格
| 参数 | 规格 |
|---|---|
| 处理器架构 | RISC-V @ 400MHz |
| 输入接口 | QSPI / SPI / MCU 8080（3线/4线） |
| 输出接口 | RGB 18/24bit |
| 最高分辨率 | 1024×768（RGB）/ 800×480（MIPI） |
| 帧缓存 | 内置大容量 SRAM，支持全帧缓冲 |
| 色深 | 16bit（RGB565） |
| 供电电压 | 5V 单电源供电 |
| 功耗 | 典型功耗 < 200mW，低功耗待机模式 < 50μA |
| 工作温度 | -20°C ~ +70°C（工业级可选 -40°C ~ +85°C） |
| 封装 | QFN68（68pin，25mm × 25mm） |
技术亮点
- 多协议输入兼容：同时支持 QSPI（4线高速）、SPI（3线/4线标准）和 MCU 8080 并行接口，适配市面上绝大多数 MCU 平台
- 智能协议转换：硬件自动完成 QSPI→RGB协议转换，无需主控端做任何适配，真正做到即插即用
- 硬件加速刷新：内置 DMA 引擎与硬件加速单元，支持高帧率画面刷新（典型 30fps@800×480），杜绝画面撕裂与卡顿
- 超低主控负载：仅需主控端发送少量 QSPI 指令即可完成画面更新，释放主控 CPU 资源用于其他任务
TR230S 芯片优势
| TR230S (TDO) | A 公司 | B 公司 | C 公司 | |
|---|---|---|---|---|
| 输入接口 | SPI / Dual SPI / QSPI / 8080 / 6800 | SPI / Dual SPI / QSPI | 8080 / 6800 | SPI / 8080 / 6800 |
| 最大分辨率 | 1024 * 768 | 800 * 600 | 864 * 480 | 800 * 480 |
| SPI / 8080 刷新率 | 100 MHz (SPI) 50 MHz (8080) | 30 MHz (SPI) | 50 MHz (8080) | 30 MHz (SPI) 50 MHz (8080) |
| 显示引擎 | 支持 | 支持 | 不支持 | 不支持 |
| 图像引擎 | 支持 | 支持 | 不支持 | 不支持 |
| 芯片存储 | 8 MB | 1 MB | 1 MB | 768 KB |
| 嵌入式闪存 | 8 MB | No | 不支持 | 不支持 |
| 颜色 | 16.7 M | 16.7 M | 16.7 M | 65 K |
| 集成字库 | 支持 | 支持 | 不支持 | 不支持 |
| 封装 (mm) | QFN68 (7 * 7) | VQFN56 (8 * 8) | LQFP-128 (16 * 16) | LQFP-100 (14 * 14) |
📌 TR230S 关键优势一览 接口更全：SPI / / QSPI / 8080 / 三合一。 分辨率更高：1024×768，领先 A 公司 28%、B/C 公司的 2 倍以上。 存储更大：8 MB 芯片存储 + 8 MB 嵌入式闪存，比 A 公司 1 MB 多 8 倍。 封装更小：QFN68 (7×7)，更易嵌入小尺寸模组。
产品形态对比
为满足不同客户的集成需求，QSPI 高分辨率模组提供以下三种产品形态，客户可根据自身项目需求灵活选择：
| 特性 | 标准化小板 | COF（Chip on FPC） | 塑壳一体化 |
|---|---|---|---|
| 结构形式 | PCB 板载 + 排针引出 | 芯片绑定在 FPC 上 | 模组 + 结构件一体化 |
| 厚度 | 较厚（含 PCB） | 超薄（仅 FPC + 屏幕） | 取决于结构设计 |
| 开发便捷性 | ⭐⭐⭐⭐⭐ 即插即用 | ⭐⭐⭐ 需自行设计转接板 | ⭐⭐⭐⭐⭐ 开箱即用 |
| 集成灵活性 | ⭐⭐⭐ 尺寸固定 | ⭐⭐⭐⭐⭐ 极致灵活 | ⭐⭐ 结构已定型 |
| 量产成本 | 中等 | 较低 | 中等（含结构件） |
| 适用阶段 | 原型验证、小批量 | 大批量定制 | 批量生产 |
| 代表型号 | TS034WVS02NP-B1477A | TS050WVH02CQ-B8003A | TS070WVH03CP-B1705A |
分辨率覆盖范围
TR230S 芯片支持多种分辨率组合，覆盖主流应用场景：
| 分辨率 | 典型尺寸 | 典型应用 | 代表型号 |
|---|---|---|---|
| 480×480 | 2.1" / 2.8" / 3.4" / 4.0" | 智能手表、圆形面板 | TS021WVC02NP-B1323B |
| 320×820 | 2.86" | 条形显示屏、智能音箱 | TS028FWV02NP-I1440A |
| 340×800 | 3.5" | 手持设备、仪表盘 | TS035WVV02NP-B1683A |
| 400×960 | 3.99" | 条形面板、智能家居 | TS040FWV02NP-B1519B |
| 720×720 | 4.0" | 圆形中控、智能家电 | TS040HDC02NP-B1613A |
| 800×480 | 4.3" / 5.0" / 7.0" | HMI 人机界面、工控屏 | TS050WVH02CQ-B8003A |
| 480×854 | 5.0" | 竖屏手持设备 | TS050FWV01NP-H1336A |
| 480×960 | 6.0" | 竖屏显示、广告机 | TS060WVV02NP-I1360A |
| 1024×600 | 7.0" / 10.1" | 高清工控屏、POS 机 | TS101WSH02CQ-B8014A |
应用场景
基于 TR230S 的 QSPI 高分辨率模组方案广泛应用于以下领域：
| 领域 | 典型应用 |
|---|---|
| 智能家居 | 中控面板、温控器、智能门锁、智能音箱显示屏 |
| 工业控制 | HMI 人机界面、PLC 显示屏、仪器仪表、变频器面板 |
| 医疗设备 | 血氧仪、血压计、便携监护仪、输液泵显示屏 |
| 消费电子 | 桌面摆件、电子标签、智能手表、翻译机 |
| 车载显示 | 仪表盘副屏、中控辅助屏、行车记录仪 |
| 物联网 IoT | 各类嵌入式终端显示设备 |
快速开始
请参考以下步骤快速上手 QSPI 高分辨率模组：
第一步：选择模组
根据尺寸、分辨率和产品形态需求，在 产品列表 中筛选合适的型号。
第二步：硬件连接
按照规格书引脚定义，将模组 QSPI/SPI 接口与主控板对应连接。QSPI 模式仅需 6 根信号线（CS、SCLK、IO0~IO3），接线简洁。
第三步：初始化配置
参考 常见问题（FAQ） 中的驱动方式介绍，完成寄存器初始化配置，包括背光开启、显示区域设定等。
第四步：运行 Demo
下载 示例代码（支持 STM32、ESP32 等平台），快速验证显示效果。
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